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3G Wifi Lead Free PCB Board Assembly Through Hole Assembly , 1 Layer - 30 Layer

Categories PCB Board Assembly
Brand Name: HUASWIN
Model Number: HSPCBA1005
Certification: ISO/UL/RoHS
Place of Origin: China
MOQ: 1 sets
Price: Negotiation
Payment Terms: T/T, Western Union, L/C
Supply Ability: 10,000pcs per month
Delivery Time: 15-20 working days
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
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    3G Wifi Lead Free PCB Board Assembly Through Hole Assembly , 1 Layer - 30 Layer


    3G Wifi Lead Free PCB Board Assembly Through Hole Assembly , 1 Layer - 30 Layer


    Specifications


    1. The high standard workshops for SMT, DIP, and Assembling ensure our strong processing capacity.
    2. Abundant experience and strong ability in material sourcing, manufacturing, test and quality management.
    3. Products in kinds of fields, such as Power, Communication equipment, remote control system, car DVD,

    GPS navigation and consumer electronic products etc.


    Welcome to Huaswin!

    Huaswin Electronics is a professional PCB & PCB Assembly manufacturer, located in Shenzhen, China.

    We supply one-stop facility services: PCB design, PCB fabrication, components procurement, SMT and DIP

    assembly ,IC pre-programming / burning on-line, testing, packing.


    PCB capability and services:


    1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)

    2. Flexible PCB (up to 10 layers)

    3. Rigid-flex PCB (up to 8 layers)

    4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
    5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
    6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
    7. Quantities range from prototype to volume production.
    8. 100% E-Test


    Detailed Specification of PCB Manufacturing


    1

    layer

    1-30 layer

    2

    Material

    CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide,

    Aluminum-based material.

    3

    Board thickness

    0.2mm-6mm

    4

    Max.finished board size

    800*508mm

    5

    Min.drilled hole size

    0.25mm

    6

    min.line width

    0.075mm(3mil)

    7

    min.line spacing

    0.075mm(3mil)

    8

    Surface finish

    HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold,

    OSP

    9

    Copper thickness

    0.5-4.0oz

    10

    Solder mask color

    green/black/white/red/blue/yellow

    11

    Inner packing

    Vacuum packing,Plastic bag

    12

    Outer packing

    standard carton packing

    13

    Hole tolerance

    PTH:±0.076,NTPH:±0.05

    14

    Certificate

    UL,ISO9001,ISO14001,ROHS,TS16949

    15

    Profiling punching

    Routing,V-CUT,Beveling



    PCB Assembly services:


    SMT Assembly
    Automatic Pick & Place
    Component Placement as Small as 0201
    Fine Pitch QEP - BGA
    Automatic Optical Inspection

    Through-hole Assembly
    Wave Soldering
    Hand Assembly and Soldering

    Material Sourcing
    IC pre-programming / Burning on-line

    Function testing as requested

    Aging test for LED and Power boards

    Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
    Packing design


    Conformal coating
    Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is

    applied onto the printed circuit board assembly to protect the electronic assembly from damage due to

    contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.

    When coated, it is clearly visible as a clear and shiny material.


    Complete box build
    Complete 'Box Build' solutions including materials management of all components, electromechanical parts,

    plastics, casings and print & packaging material


    Testing Methods

    AOI Testing
    · Checks for solder paste
    · Checks for components down to 0201"
    · Checks for missing components, offset, incorrect parts, polarity

    X-Ray Inspection
    X-Ray provides high-resolution inspection of:
    · BGAs
    · Bare boards


    In-Circuit Testing
    In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by

    component problems.
    · Power-up Test
    · Advanced Function Test
    · Flash Device Programming
    · Functional testing


    Detailed Specification of Pcb Assembly


    1

    Type of Assembly

    SMT and Thru-hole

    2

    Solder Type

    Water Soluble Solder Paste,Leaded and Lead-Free

    3

    Components

    Passives Down to 0201 Size

    BGA and VFBGA

    Leadless Chip Carries/CSP

    Double-Sided SMT Assembly

    Fine Pitch to 08 Mils

    BGA Repair and Reball

    Part Removal and Replacement-Same Day Service

    3

    Bare Board Size

    Smallest:0.25x0.25 Inches

    Largest:20x20 Inches

    4

    File Formats

    Bill of Materials

    Gerber Files

    Pick-N-Place File(XYRS)

    5

    Type of Service

    Turn-Key,Partial Turn-Key or Consignment

    6

    Component Packaging

    Cut Tape

    Tube

    Reels

    Loose Parts

    7

    Turn Time

    15 to 20 days

    8

    Testing

    AOI inspection

    X-Ray inspection

    In-Circuit testing

    Functional test


    Quality 3G Wifi Lead Free PCB Board Assembly Through Hole Assembly , 1 Layer - 30 Layer for sale
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